Also described are some of the specific industrial areas which are turning to sputter- deposition techniques. Sputtered film characteristics, such as strong adherence and coherence and film morphology, are briefly evaluated in terms of varying the sputtering parameters. Sputter- deposition is described in terms of the unique advantageous features it offers such as versatility, momentum transfer, stoichiometry, sputter-etching, target geometry (coating complex surfaces), precise controls, flexibility, ecology, and sputtering rates. The basic mechanism for dc and rf sputtering is described.

Since sputtering is not regulated by classical thermodynamics, new multicomponent materials can be developed in any possible chemical composition. This paper primarily reviews the potential of using the sputtering process as a deposition technique however, the manufacturing and sputter etching aspects are also discussed. [as deposition technique in mechanical engineering The authors describe the applications of cathodic vacuum arc technique, and then a filtered plasma deposition and ion implantation system as well as its applications It is a new technique for making high quality, fine and close thin films which have very widespread applications. The microparticles emitted from the cathode in the metal plasma can be removed when the metal plasma passes through the magnetic filter. Magnetic filtered plasma deposition and implantation techniqueĪ high dense metal plasma can be produced by using cathodic vacuum arc discharge technique. A numerical study shows how different cooling conditions affect the solidification rate of the material Based on these experiments, a model has been developed to simulate the thermal history and the local solidification rates of the deposited material. Deposition experiments with a Cu-6Sn alloy were conducted to evaluate the appropriateness of impulse atomization to produce dense material. This single fluid atomization technique leads to different spray characteristics and impact conditions of the droplets compared to gas atomization technique which is the common technique used for spray deposition. Uhlenwinkel, V.Ī novel technique, impulse atomization, has been used for spray deposition. International Nuclear Information System (INIS)Įllendt, N. Spray deposition using impulse atomization technique

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